With the rise of the AI generation, advanced packaging is moving towards the integration of large-size, high-efficiency and high-density heterogeneous quality, and the challenge of tuning in packaging structure and hot processes is becoming increasingly severe. Semiconductor materials manufacturer Chongyue Technology will publish technical solutions for anti-tuning loaders for crystalline and panel-level packaging.
Chongyue Technology stated that in the same-level process, the structures such as wafer (Die), packaging substrate, bottom-filling, intermediary layer and cover layer are prone to stress accumulation in repeated heat circulation due to the difference in heat expansion of the material, the difference in curing and shrinkage and thickness. In addition, the wafer circles may also cause deformation and flexion during the process periods of bonding, pressure, heat bonding, welding, etc., which is a painful point that needs to be optimized in packaging industries. Chongyue Technology has proposed a solution for anti-rod carriers, which can help Taiwan's semiconductor industry continue to sail on the global stage with high reliability technical support and stable supply chain capabilities.
For the problem of high-level packaging, Chongyue Technology proposed a "blue stone single crystal substrate" with high melting point and high hardness as a solution. Blue stone has high precision and wear resistance, which can effectively suppress flexion and has an ultraviolet and red outer penetration rate of more than 85%. It can be flexible with various solutions to support future panel-level packaging (PLP) process requirements. Chen Deyi, executive director of Chongyue Technology, said that compared with traditional glass covers, blue gauze's high strength can effectively solve high-level packaging structure tumbling, helping customers improve the stability of their processes. At present, only Chongyue Technology in Taiwan provides blue stone single crystal substrates with more excellent accuracy.
Chongyue Technology has been emphasizing that it has been deeply engaged in semiconductor key materials and equipment for many years, and has worked closely with international factories to introduce advanced packaging solutions. In the 2025 Semiconductor Exhibition, blue gem substrate raw materials - blue gem crystal, as well as 12-inch single crystal substrate and a variety of square substrates of specifications, showing diversified product strength.
With different packaging needs, Chongyue Technology provides "blue stone substrate" with extreme curve control and stable high temperature process to "glass substrate" with cost advantages, and "silicon substrate" with thermal expansion matching chips, to fully meet customer needs. As customers accelerate overseas expansion, Chongyuesheng continues to provide the most suitable materials through a complete local service and international supply chain platform to help customers maintain competitive advantages in the global market.