This article will take you through: Microfluidics cooling goes directly to the core of the SoC chip, eliminating the TIM layer heat dissipation bottleneck. Microfluidics cooling has the potential to subvert the heat dissipation market, but commercialization still takes more than 5 years. Microsoft published an article on September 24, officially announcing that it has developed a new cooling system "in-chip Microfluidics cooling system". This technology has attracted special attention in the era of high power consumption of AI. Experimental data shows that the heat dissipation efficiency of Microfluidics Cooling can reach 3 times that of traditional water-cooling plates, and the design no longer requires components such as heat vaporizers or water-cooling plates. This article will take you to understand: Microfluidics cooling goes directly to the core of the SoC chip, eliminating the heat dissipation bottleneck of the TIM layer. Microfluidics cooling has the potential to subvert the heat dissipation market, but commercialization still takes more than 5 years.